FF450R08A03P2XKSA1
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- V(CE)
- 750 V
- I(C)
- 450 A
- V(CEsat)
- 1.2 V
- Encapsulado
- MDIP-14
- Bodydiode
- YES
- Automoción
- SEE DATAS.
- t(r)
- 60 nS
- td(off)
- 480 nS
- td(on)
- 340 nS
- Montaje
- SMD
- RoHS Status
- RoHS-conform
- Embalaje
- TUBE
- Artículo fabricante
- SP001630036
- ECCN
- EAR99
- Número de tarifa aduanera
- 85412900000
- País
- Germany
- Clave-ABC
- A
- Plazo de entrega del proveedor
- 46 Semanas
750 V, 450 A dual automotive qualified IGBT module
The HybridPACKTM DSC S2 is a very compact half-bridge module targeting Hybrid- and Electric Vehicle applications. The module is based on Infineon’s long-term experience developing IGBT power modules and implements the EDT2 IGBT generation. The innovative and small package is designed for Double Sided Cooling (DSC) with superior thermal performance and enables highest power density. It targets main inverters with power up to 75 kW.
Summary of Features
- On-chip Current Sensor
- On-chip Temperature Sensor
- Low Inductive Design
- Blocking voltage 750V
- Low Switching Losses
- Short-time extended Operation Temperature Tvj op = 175°C
- Full automotive qualification according to AQG324
Benefits
- Superior thermal performance
- Very compact and light power module for achieving highest power density
- Enables high inverter efficiency through EDT2 IGBT technology with on-chip sensors
- Optimized for automotive applications with DC link voltages up to 450 V and gate driver voltage level of -8 V / +15 V
Potential Applications
- Automotive Applications
- Hybrid Electrical Vehicles (H)EV
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